The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.
The Global Power Module Packaging Market Market Research Report, recently added to Emergen Research’s expanding repository, is a comprehensive document offering crucial insights into the Power Module Packaging Market market and its most significant elements. Compiled through thorough primary and secondary research, the report aims to equip businesses and readers with a competitive edge, helping them stay ahead of the curve. By analyzing various aspects of the market, including current trends, growth potential, and key challenges, the report serves as a valuable resource for strategizing and decision-making.
In addition to an in-depth exploration of market dynamics, the report also sheds light on the competitive landscape, profiling major players in the Power Module Packaging Market market. The detailed analysis covers market shares, business strategies, product portfolios, and recent developments in the industry. With the rapidly evolving nature of this sector, the report ensures that businesses remain informed and ready to capitalize on emerging opportunities.
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The report also talks about the expansions these prominent players are vying for in the key regions of the market. The report focuses on the detailed analysis of the technological and product developments undertaken by these companies.
The key companies studied in the report are:
SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc
Competitive Terrain:
The Global Power Module Packaging Market Market is highly consolidated due to the presence of a large number of companies across this industry. The report discusses the current market standing of these companies, their past performances, demand and supply graph, production and consumption patterns, sales network, distribution channels, and growth opportunities in the market at length.
Power Module Packaging Market Market Overview:
The report bifurcates the Power Module Packaging Market Market on the basis of different product types, applications, end-user industries, and key regions of the world where the market has already established its presence. The report accurately offers insights into the supply-demand ratio and production and consumption volume of each segment.
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Segments Covered in this report are:
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Power Module Type Outlook (Revenue, USD Billion; 2019-2032)
- Silicon Carbide (SiC) Module
- Gallium Nitride (GaN) Module
- Insulated-Gate Bipolar Transistor (IGBT) Module
- Field-Effect Transistor (FET) Module
- Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
- Others
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Technology Outlook (Revenue, USD Billion; 2019-2032)
- Standard Packaging
- Advanced Packaging
- Pressure-Contact Modules
- Others
-
Thermal type Outlook (Revenue, USD Billion; 2019-2032)
- Liquid-Cooled
- Air-Cooled
- Hybrid
Regional Outlook :
Global growth across the Power Module Packaging Market Market is shaped by varying regional dynamics. North America and Europe are at the forefront, benefiting from technological innovations and robust regulatory standards, though challenges such as supply chain interruptions and regulatory compliance remain. In Asia-Pacific, notably China and India, rapid urbanization and growing consumer markets are driving significant expansion. Simultaneously, Latin America, the Middle East, and Africa offer emerging growth opportunities, fueled by economic reforms and increased investment, although political instability and inadequate infrastructure hinder sustained progress.
The report addresses the following key points:
- The report estimates the expected market size from 2020-2027
- The report provides a forecast of market drivers, restraints, and future opportunities for the Power Module Packaging Market market
- The report further analyses the changing market dynamics
- Regional analysis and segmentation of the market with analysis of the regions and segments expected to dominate the market growth
- Extensive competitive landscape mapping with profiles of the key competitors
- In-depth analysis of business strategies and collaborations such as mergers and acquisitions adopted by the key companies
- Revenue forecast, country scope, application insights, and product insights
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